ResinLab EP1282 Clear is a two component, room temperature or heat curing, unfilled, flame resistant, epoxy encapsulant that is used for medium castings. It offers good wetting, semi-rigid polymer, high gloss surface, good thermal shock and cycling properties. It is resistant to bases, acids, water, and most organic solvents. Part A, 5 gal Pail.
| Typical Use: | Designed for medium sized castings. | 
| Chemical Composition: | Epoxy | 
| Color: | Clear | 
| Components: | 2 part | 
| Cure System: | Room Temperature/Heat | 
| Cure Time: | 24 to 48h @ room temperature; 1h @ 65 °C; 20min @ 100 °C | 
| Dielectric Strength: | 500 V/mil | 
| Elongation: | 120% @ 10,000 psi | 
| Flash Point: | >252 °C | 
| Hardness: | 70 D | 
| Mix Ratio: | 1:1 by volume; 1.17:1 by weight | 
| Service Temperature: | -40 to 150 °C | 
| Specific Gravity: | Part A: 1.14; Mixed: 1.06 | 
| Tensile Strength: | 1,600 psi | 
| Thermal Conductivity: | 0.11 W/mK | 
| Viscosity: | Part A: 6,000; Mixed: 3,000 | 
| Volume Resistivity: | 7.44 x 10^11 ohm-cm | 
| Working Time: | 1h |