Dow DOWSIL™ 1-4174 Thermally Conductive Adhesive Gray is a one component, solvent free, silicone polymer that is used for bonding electronic components, housings, lids, base plates, and heat sinks. It is heat curing, self-leveling, flowable, high tensile strength, and allows controlled bond line thickness. 1.5 kg Cartridge.
| Typical Use: | Bonding integrated circuit substrates; adhering lids and housings; attaching base plates and heat sinks. | 
| Brand: | DOWSIL | 
| Color: | Gray | 
| Components: | 1 part | 
| Cure Time: | 90min @ 100 °C; 30min @ 125 °C; 20min @ 150 °C | 
| Dielectric Strength: | 16.7 kV/mm | 
| Elongation: | 22% | 
| Flash Point: | >100 °C | 
| Hardness: | 92 A | 
| Service Temperature: | -45 to 200 °C | 
| Shear Strength: | 590 | 
| Specific Gravity: | 2.7 @ 25 °C | 
| Tensile Strength: | 900 psi | 
| Thermal Conductivity: | 1.9 W/mK @ 25 °C | 
| Viscosity: | 58,000 | 
| Volume Resistivity: | 1.9e + 14 ohm-cm |